Reliability of lead-free interconnections under consecutive thermal and mechanical loadings

Reliability of Lead-Free Interconnections under Consecutive Thermal and Mechanical Loadings

To simulate more realistically the effects of strains and stresses on the reliability of portable electronic products, lead-free test assemblies were thermally cycled (−45°C/+125°C, 15-min. dwell time, 750 cycles) or isothermally annealed (125°C, 500 h) before the standard drop test. The average number of drops to failure increased when the thermal cycling was performed before the drop test (1,...

Thermal Cycling Reliability of Chip Resistor Lead Free Solder Joints

The solder joint reliability of ceramic chip resistors assembled to laminate substrates has been a long time concern for systems exposed to harsh environments such as those found in automotive and aerospace applications. This is due to a combination of the extreme temperature excursions experienced by the assemblies along with the large coefficient of thermal expansion mismatches between the al...

Lead Free Conductive Composites for Electrical Interconnections

Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections

When lead-free solder alloys mix with lead-free component and board metallizations during reflow soldering, the solder interconnections become multicomponent alloy systems whose microstructures cannot be predicted on the basis of the SnPb metallurgy. To better understand the influences of these microstructures on the reliability of lead-free electronics assemblies, SnAgCu-bumped components were...

Numerical Simulations for Reliability Assessment of Lead-Free Solder Interconnections in BGA Packages

Aalto University, P.O. Box 11000, FI-00076 Aalto www.aalto.fi Author Jue Li Name of the doctoral dissertation Numerical Simulations for Reliability Assessment of Lead-Free Solder Interconnections in BGA Packages Publisher School of Electrical Engineering Unit Department of Electronics Series Aalto University publication series DOCTORAL DISSERTATIONS 48/2011 Field of research Electronics Product...